Description
Low viscosity, unfilled epoxy casting resin system, curing at room temperature. High filler addition possibility.
Product may differ slightly in terms of colour, pack size and appearance
Product Overview
Application:
Encapsulating or potting of low voltage and electronic components.
Processing:
Casting; vacuum casting.
Key Properties:
Good mechanical strength.
Good resistance to atmospheric and chemical degradation.
Excellent electrical properties.
Technical Spec
Health & Safety Data Sheet